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Dan Deisz
Dan Deisz
Vice President of Design Technology | Rochester Electronics, LLC
Washington, District of Columbia, United States
Dan Deisz
Summary
Dan Deisz is an accomplished Vice President of Design Technology at Rochester Electronics, where he leads a team focused on semiconductor product cloning and porting. With over 35 years of experience in the semiconductor industry, he has held various roles from design engineer to technology marketing, showcasing his versatility and depth of knowledge. He is known for his strong communication skills, particularly in articulating technical strategies to clients and stakeholders. Dan has contributed to the field through publications and holds a patent related to semiconductor technology. His educational background includes a BSEE from the University of Alabama, specializing in Digital Design. Dan's passion lies in extending the lifecycle of semiconductor products, ensuring they meet current market demands while honoring original manufacturers. He is also keen on mentoring the next generation of engineers, emphasizing the importance of collaboration and innovation in technology development.
Dan Deisz
Work Experience
Vice President of Design Technology at
Rochester Electronics, LLC
January 2023 - Present
Director of Design Technology at
ROCHESTER ELECTRONICS PTE. LTD.
May 2014 - Present
Design Manager at
ROCHESTER ELECTRONICS PTE. LTD.
March 2008 - May 2014
Director of Technology Marketing at
LSI, an Avago Technologies Company
June 2006 - February 2008
Director ASIC FAE's at
Lsi Logic
March 2006 - June 2006
Director RapidChip/ASIC FAE's at
Lsi Logic
January 2005 - March 2006
RapidChip Slice Development at
Lsi Logic
July 2002 - December 2004
Director North American Design Centers at
Lsi Logic
June 1997 - June 2002
Design Center Manager at
Lsi Logic
May 1990 - May 1997
Design Center Engineer at
Lsi Logic
May 1987 - May 1990
Design Engineer at
Harris Corporation
June 1984 - April 1987
Dan Deisz
Education
University of Alabama, Bsee
January 1982 - January 1984
January 1979 - January 1982
Frequently Asked Questions about Dan Deisz
What is Dan Deisz email address?
Dan Deisz's primary email address is ******@rocelec.com. To view the full verified email and additional contact details, sign up for free with Muraena.
What company does Dan Deisz work for?
Dan Deisz is a Vice President of Design Technology at Rochester Electronics, LLC, a company specializing in Semiconductors & related devices.
Where Dan Deisz graduated from?
Dan Deisz holds a degree in Digital Design from University of Alabama.
How can I directly contact Dan Deisz?
To contact Dan Deisz directly, you can use the email address ******@rocelec.com. Complete contact information is available upon registration with Muraena.
Who is Dan Deisz?
Dan Deisz is an accomplished Vice President of Design Technology at Rochester Electronics, where he leads a team focused on semiconductor product cloning and porting. With over 35 years of experience in the semiconductor industry, he has held various roles from design engineer to technology marketing, showcasing his versatility and depth of knowledge. He is known for his strong communication skills, particularly in articulating technical strategies to clients and stakeholders. Dan has contributed to the field through publications and holds a patent related to semiconductor technology. His educational background includes a BSEE from the University of Alabama, specializing in Digital Design. Dan's passion lies in extending the lifecycle of semiconductor products, ensuring they meet current market demands while honoring original manufacturers. He is also keen on mentoring the next generation of engineers, emphasizing the importance of collaboration and innovation in technology development.
Dan`s contact details
******@rocelec.com
Colleagues
WW VP Supplier Development
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Retired
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