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Gary Hamming
Gary Hamming
VP Wafer Level CSP/DPS | Amkor Technology, Inc.
Chandler, Arizona, United States
Gary Hamming
Summary
Gary Hamming is a seasoned executive with over three decades of experience in the semiconductor industry, currently serving as the VP of Wafer Level CSP/DPS at Amkor Technology. His extensive technical expertise spans various domains including analog design, failure analysis, and reliability engineering, making him a pivotal figure in engineering management. Gary's leadership style is characterized by cross-functional collaboration and a strong commitment to process improvement through methodologies like Lean Manufacturing and Six Sigma. He has a proven track record of driving innovation and efficiency in semiconductor packaging and process integration. His long tenure at Amkor Technology reflects his dedication to the field and his ability to adapt to industry changes. Gary is also passionate about mentoring emerging leaders in technology and engineering.
Gary Hamming
Work Experience
VP Wafer Level CSP/DPS at
Amkor Technology, Inc.
September 1990 - Present
Sr Packaging Engineer at
Texas Instruments China Incorporated
January 1984 - January 1990
Gary Hamming
Education
Michigan State University
Frequently Asked Questions about Gary Hamming
What is Gary Hamming email address?
Gary Hamming's primary email address is *****@amkor.com. To view the full verified email and additional contact details, sign up for free with Muraena.
What company does Gary Hamming work for?
Gary Hamming is a VP Wafer Level CSP/DPS at Amkor Technology, Inc., a company specializing in Semiconductors & related devices.
Where Gary Hamming graduated from?
Gary Hamming holds a degree in from Michigan State University.
How can I directly contact Gary Hamming?
To contact Gary Hamming directly, you can use the email address *****@amkor.com. Complete contact information is available upon registration with Muraena.
Who is Gary Hamming?
Gary Hamming is a seasoned executive with over three decades of experience in the semiconductor industry, currently serving as the VP of Wafer Level CSP/DPS at Amkor Technology. His extensive technical expertise spans various domains including analog design, failure analysis, and reliability engineering, making him a pivotal figure in engineering management. Gary's leadership style is characterized by cross-functional collaboration and a strong commitment to process improvement through methodologies like Lean Manufacturing and Six Sigma. He has a proven track record of driving innovation and efficiency in semiconductor packaging and process integration. His long tenure at Amkor Technology reflects his dedication to the field and his ability to adapt to industry changes. Gary is also passionate about mentoring emerging leaders in technology and engineering.
Gary`s contact details
*****@amkor.com
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