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Roy Furbank
Roy Furbank
Vice President, Process Engineering | Hemlock Semiconductor
Pennsylvania, United States
Roy Furbank
Summary
Roy Furbank is a seasoned chemical engineer with a Ph.D. in Chemical Engineering from the Georgia Institute of Technology. Currently serving as Vice President of Process Engineering at Hemlock Semiconductor, he has a robust track record of enhancing process capabilities in the production of hyper-pure polysilicon. With extensive leadership experience in large chemical manufacturing companies, Roy has successfully led cross-functional teams, driving productivity and quality improvements. His technical expertise spans a wide range of areas including emulsion polymerization, fluid dynamics, and applied mathematics. Beyond his technical skills, Roy's military background as a commissioned officer in the US Army has instilled in him a strong sense of discipline and leadership. He is passionate about employee development and fostering innovation in engineering processes. Roy's career reflects a commitment to continuous improvement and excellence in manufacturing operations, making him a valuable asset to any organization.
Roy Furbank
Work Experience
Vice President, Process Engineering at
Hemlock Semiconductor
November 2023 - Present
Global Director at
PT. AXALTA COATING SYSTEMS INDONESIA
July 2019 - December 2023
Technology Manager - Global Process Development at
PT. AXALTA COATING SYSTEMS INDONESIA
April 2019 - December 2023
Global Technology Leader at
DOW UK LIMITED
November 2012 - December 2023
Global Improvement Leader - New Product Scale Up at
DOW UK LIMITED
October 2011 - November 2012
Global Improvement Leader - Plant Support at
DOW UK LIMITED
March 2010 - October 2011
Group Leader at
Rohm and Haas
January 2007 - January 2009
Scale Up Engineer at
Rohm and Haas
January 2006 - January 2007
Rotational Engineer at
Rohm and Haas
January 2004 - January 2006
Commissioned officer at
Hubrecht Franky Philip
January 1995 - January 1999
Roy Furbank
Education
Georgia Institute of Technology, Ph.D.
January 1999 - January 2004
The University of Texas at Austin, B.S.
January 1990 - January 1995
Frequently Asked Questions about Roy Furbank
What is Roy Furbank email address?
Roy Furbank's primary email address is ***********@hscpoly.com. To view the full verified email and additional contact details, sign up for free with Muraena.
What company does Roy Furbank work for?
Roy Furbank is a Vice President, Process Engineering at Hemlock Semiconductor, a company specializing in Industrial inorganic chemicals, nec.
Where Roy Furbank graduated from?
Roy Furbank holds a degree in Chemical Engineering from Georgia Institute of Technology.
How can I directly contact Roy Furbank?
To contact Roy Furbank directly, you can use the email address ***********@hscpoly.com. Complete contact information is available upon registration with Muraena.
Who is Roy Furbank?
Roy Furbank is a seasoned chemical engineer with a Ph.D. in Chemical Engineering from the Georgia Institute of Technology. Currently serving as Vice President of Process Engineering at Hemlock Semiconductor, he has a robust track record of enhancing process capabilities in the production of hyper-pure polysilicon. With extensive leadership experience in large chemical manufacturing companies, Roy has successfully led cross-functional teams, driving productivity and quality improvements. His technical expertise spans a wide range of areas including emulsion polymerization, fluid dynamics, and applied mathematics. Beyond his technical skills, Roy's military background as a commissioned officer in the US Army has instilled in him a strong sense of discipline and leadership. He is passionate about employee development and fostering innovation in engineering processes. Roy's career reflects a commitment to continuous improvement and excellence in manufacturing operations, making him a valuable asset to any organization.
Roy`s contact details
***********@hscpoly.com
********@dow.com
***********@axalta.com
Colleagues
Chief Executive Officer
Senior VP Commercial
VP of Manufacturing
Chief Information Officer
Board Member
Executive Vice President & Chief Financial Officer
Chief of Staff
Sr Vice President of Advocacy and Engagement
CISO and IT/OT Infrastructure Leader
Chief Financial Officer