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Seckin Ozol

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Seckin Ozol

Vice President | Transhield, Inc.

United States

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Seckin Ozol

Summary

Seckin Ozol is an accomplished Vice President of Engineering, Research and Development at Transhield Inc., specializing in the plastics product manufacturing industry. With a robust background in packaging engineering, he holds a Bachelor of Science degree from Michigan State University and an Executive MBA from the University of Notre Dame. Seckin is well-versed in various technical domains, including adhesive bonding, corrosion protection, and process engineering. His extensive experience spans over 15 years at Transhield, where he has transitioned from a Packaging/R&D Engineer to a leadership role. He has contributed to advancements in product development and continuous improvement, showcasing his commitment to innovation. Seckin is also a published author, having written about corrosion prevention strategies for military applications. His ability to lead cross-functional teams and drive growth strategies reflects his strong business acumen in a competitive market.

General

Specialist

Technical Background

Leadership Experience

Long-Term Tenure

Professional interests

Emerging Technologies

Leadership Development

Innovation

Organisational experience

Corporate Experience

Seckin Ozol

Work Experience

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Vice President at

Transhield, Inc.

January 2015 - Present

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Packaging / R&D Engineer at

Transhield, Inc.

March 2006 - January 2015

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Seckin Ozol

Education

University of Notre Dame - Mendoza College of Business, Executive Mba

January 2020 - January 2022

Michigan State University, Bachelor Of Science (B.S.)

January 2000 - January 2005

Frequently Asked Questions about Seckin Ozol

What is Seckin Ozol email address?

Seckin Ozol's primary email address is ********@transhield-usa.com. To view the full verified email and additional contact details, sign up for free with Muraena.

What company does Seckin Ozol work for?

Seckin Ozol is a Vice President at Transhield, Inc., a company specializing in Paper; coated & laminated packaging.

Where Seckin Ozol graduated from?

Seckin Ozol holds a degree in from University of Notre Dame - Mendoza College of Business.

How can I directly contact Seckin Ozol?

To contact Seckin Ozol directly, you can use the email address ********@transhield-usa.com. Complete contact information is available upon registration with Muraena.

Who is Seckin Ozol?

Seckin Ozol is an accomplished Vice President of Engineering, Research and Development at Transhield Inc., specializing in the plastics product manufacturing industry. With a robust background in packaging engineering, he holds a Bachelor of Science degree from Michigan State University and an Executive MBA from the University of Notre Dame. Seckin is well-versed in various technical domains, including adhesive bonding, corrosion protection, and process engineering. His extensive experience spans over 15 years at Transhield, where he has transitioned from a Packaging/R&D Engineer to a leadership role. He has contributed to advancements in product development and continuous improvement, showcasing his commitment to innovation. Seckin is also a published author, having written about corrosion prevention strategies for military applications. His ability to lead cross-functional teams and drive growth strategies reflects his strong business acumen in a competitive market.

Seckin`s contact details

mail

********@transhield-usa.com

Colleagues

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senior VP

Konrad Bereza

Chief Financial Officer

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Brian Mckenzie

Vice President Operations

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Jeff Vold

Vice President of Government Business Development

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