Directory
>
Seckin Ozol
Seckin Ozol
Vice President | Transhield, Inc.
United States
Seckin Ozol
Summary
Seckin Ozol is an accomplished Vice President of Engineering, Research and Development at Transhield Inc., specializing in the plastics product manufacturing industry. With a robust background in packaging engineering, he holds a Bachelor of Science degree from Michigan State University and an Executive MBA from the University of Notre Dame. Seckin is well-versed in various technical domains, including adhesive bonding, corrosion protection, and process engineering. His extensive experience spans over 15 years at Transhield, where he has transitioned from a Packaging/R&D Engineer to a leadership role. He has contributed to advancements in product development and continuous improvement, showcasing his commitment to innovation. Seckin is also a published author, having written about corrosion prevention strategies for military applications. His ability to lead cross-functional teams and drive growth strategies reflects his strong business acumen in a competitive market.
Seckin Ozol
Work Experience
Vice President at
Transhield, Inc.
January 2015 - Present
Packaging / R&D Engineer at
Transhield, Inc.
March 2006 - January 2015
Seckin Ozol
Education
University of Notre Dame - Mendoza College of Business, Executive Mba
January 2020 - January 2022
Michigan State University, Bachelor Of Science (B.S.)
January 2000 - January 2005
Frequently Asked Questions about Seckin Ozol
What is Seckin Ozol email address?
Seckin Ozol's primary email address is ********@transhield-usa.com. To view the full verified email and additional contact details, sign up for free with Muraena.
What company does Seckin Ozol work for?
Seckin Ozol is a Vice President at Transhield, Inc., a company specializing in Paper; coated & laminated packaging.
Where Seckin Ozol graduated from?
Seckin Ozol holds a degree in from University of Notre Dame - Mendoza College of Business.
How can I directly contact Seckin Ozol?
To contact Seckin Ozol directly, you can use the email address ********@transhield-usa.com. Complete contact information is available upon registration with Muraena.
Who is Seckin Ozol?
Seckin Ozol is an accomplished Vice President of Engineering, Research and Development at Transhield Inc., specializing in the plastics product manufacturing industry. With a robust background in packaging engineering, he holds a Bachelor of Science degree from Michigan State University and an Executive MBA from the University of Notre Dame. Seckin is well-versed in various technical domains, including adhesive bonding, corrosion protection, and process engineering. His extensive experience spans over 15 years at Transhield, where he has transitioned from a Packaging/R&D Engineer to a leadership role. He has contributed to advancements in product development and continuous improvement, showcasing his commitment to innovation. Seckin is also a published author, having written about corrosion prevention strategies for military applications. His ability to lead cross-functional teams and drive growth strategies reflects his strong business acumen in a competitive market.
Seckin`s contact details
********@transhield-usa.com
Colleagues
senior VP
Chief Financial Officer
Vice President Operations
Vice President of Government Business Development