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Ryan Palmer

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Ryan Palmer

SVP, Global Head of Print Software | HP

Damascus, Oregon, United States

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Ryan Palmer

Summary

Ryan Palmer is an accomplished leader in the field of software and data for digital manufacturing, currently serving as the Global Head of Print Software at HP. With a career dedicated to transforming disruptive innovations into market-ready products, he has a strong background in cross-functional team leadership and engineering management. Ryan's expertise spans across various domains, including electronics, firmware, and product development, making him a versatile asset in any organization. He has a proven track record of collaborating with diverse teams to drive successful outcomes in high-stakes environments. Beyond his technical skills, Ryan is also a board member at Violett, where he contributes to innovative technology solutions. His educational foundation in Electrical and Electronics Engineering from Portland State University complements his extensive professional experience. Ryan is passionate about leveraging technology to enhance user experiences and push the boundaries of what's possible in manufacturing.

General

Generalist

Technical Background

Leadership Experience

Long-Term Tenure

Professional interests

Emerging Technologies

Leadership Development

Innovation

Organisational experience

Corporate Experience

Startup Experience

Ryan Palmer

Work Experience

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SVP, Global Head of Print Software at

HP

September 2022 - Present

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Member Board of Directors at

Violett

August 2020 - Present

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Head of HP Print Cloud at

HP

September 2021 - October 2023

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Global Head of Software and Data, 3D Printing and Digital Manufacturing at HP at

HP

July 2018 - September 2021

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COO at

ZHealth Documentation

July 2015 - July 2018

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Principal and Founder at

Innovative Wearable

July 2015 - December 2016

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Product & Platform Architecture Lead at

Intel Corporation

December 2013 - July 2015

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Product Execution Lead at

Intel Corporation

December 2012 - December 2013

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Digital Architect at

adidas

January 2012 - December 2012

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Senior Electro-Mechanical Engineer at

adidas

January 2010 - January 2012

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Electro-Mechanical Engineer at

adidas

July 2006 - January 2010

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Ryan Palmer

Education

Portland State University, Bs

January 2002 - January 2006

University of Oregon

January 2000 - January 2002

Frequently Asked Questions about Ryan Palmer

What is Ryan Palmer email address?

Ryan Palmer's primary email address is ***********@hp.com. To view the full verified email and additional contact details, sign up for free with Muraena.

What company does Ryan Palmer work for?

Ryan Palmer is a SVP, Global Head of Print Software at HP, a company specializing in Computer related services, nec.

Where Ryan Palmer graduated from?

Ryan Palmer holds a degree in Electrical And Electronics Engineering from Portland State University.

How can I directly contact Ryan Palmer?

To contact Ryan Palmer directly, you can use the email address ***********@hp.com. Complete contact information is available upon registration with Muraena.

Who is Ryan Palmer?

Ryan Palmer is an accomplished leader in the field of software and data for digital manufacturing, currently serving as the Global Head of Print Software at HP. With a career dedicated to transforming disruptive innovations into market-ready products, he has a strong background in cross-functional team leadership and engineering management. Ryan's expertise spans across various domains, including electronics, firmware, and product development, making him a versatile asset in any organization. He has a proven track record of collaborating with diverse teams to drive successful outcomes in high-stakes environments. Beyond his technical skills, Ryan is also a board member at Violett, where he contributes to innovative technology solutions. His educational foundation in Electrical and Electronics Engineering from Portland State University complements his extensive professional experience. Ryan is passionate about leveraging technology to enhance user experiences and push the boundaries of what's possible in manufacturing.

Ryan`s contact details

mail

***********@hp.com

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